Precision Reflow Soldering Chamber - meeting new standards in temperature control

T-SCAN Patented* dual-impeller
heat delivery system
*EC Patent EP1176629 and others

The T-TRACK reflow oven with its unique T-SCAN Patented* heat delivery system utilises twin cross-flow impellers to provide substrates and components with a precisely controlled thermal front which sweeps across the entire chamber, ensuring high quality solder joints with minimum thermal stress. 
  • Precision reflow performance - Unbeatable at any price
  • Inert gas option - lower reflow temperatures - better wetting - faster, controlled cooling
  • Immediate use - NO WARM UP TIME
  • Flexible assembly - NO set-up time between batches - just download the new product reflow profile
  • PC interface allows easy programming for any solder paste profile
  • Convenient bench mounting - or stack in work-cell for multiple use
  • Low cost entry - start with one unit and add more as required
  • NO conveyors = NO vibration - ideal for high precision boards
  • Fume extraction option - HEPA filter - flux management